Laser scribing and controlled fracture

Laser scribing and controlled fracture

Laser scribing uses a high-energy density laser to scan the surface of the brittle material, so that the material is heated to evaporate a small groove, and then a certain pressure is applied, and the brittle material will crack along the small groove. The lasers used for laser scribing are generally Q-switched lasers and CO2 lasers.

Controlled fracture is the use of the steep temperature distribution generated when the laser groove is carved, which generates local thermal stress in the brittle material, causing the material to break along the small groove.